Patent Assignment
Reel/Frame 015563/0621
Assignment of Assignor's Interest
Recorded: 2004-07-08
Pages: 3
Assignors
KIM, JIN-HO
Executed: 2004-06-14
KANG, IN-KU
Executed: 2004-06-14
LEE, SANG-YEOP
Executed: 2004-06-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Wire Bonding Method, Semiconductor Chip, and Semiconductor Package