Patent Assignment
Reel/Frame 015572/0510
Corrected Assignment
Recorded: 2004-07-19
Pages: 10
Assignor
YANG, CHIH-CHAO
Executed: 2003-03-28
Assignee
UNITED MICROELECTRONICS CO.
NO. 3, LI-HSIN RD II, SCIENCE BASE INDUSTRIAL PARK, ROC HSIN-CHU CITY, 30077, TAIWAN
Covered Property
(1)
In Situ Metal Barrier Deposition for Sputter Etch on an Interconnect Structure
Patent:
6,784,105 →
Application:
10/410,496 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 9, 2003
From: COWLEY, ANDY; FANG, SUNFEI
To: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
Reel/Frame 013965/0943 →
Assignment of Assignor's Interest
Apr 9, 2003
From: YANG, CHIH-CHAO; WANG, YUN; CLEVENGER, LARRY; SIMON, ANDREW
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 013965/0967 →
Assignment of Assignor's Interest
Nov 20, 2003
From: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
To: INFINEON TECHNOLOGIES AG
Reel/Frame 014147/0126 →