Patent Assignment
Reel/Frame 015575/0317
Assignment of Assignor's Interest
Recorded: 2004-07-15
Pages: 2
Assignor
NOGUCHI, TAKASHI
Executed: 2004-06-22
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Multi-Layered Circuit Board Assembly with Improved Thermal Dissipation
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.