Patent Assignment
Reel/Frame 015590/0302
Assignment of Assignor's Interest
Recorded: 2004-07-16
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Module with Vertically Mounted Semiconductor Chip Packages