Patent Assignment
Reel/Frame 015595/0166
Assignment of Assignor's Interest
Recorded: 2005-01-13
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Single Chip and Stack-Type Chip Semiconductor Package and Method of Manufacturing the Same