Patent Assignment
Reel/Frame 015602/0994
Assignment of Assignor's Interest
Recorded: 2004-07-15
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 6, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method of manufacturing semiconductor device with crack prevention ring