Patent Assignment
Reel/Frame 015607/0182
Assignment of Assignor's Interest
Recorded: 2004-07-21
Pages: 2
Assignor
WANG, SUNG-FEI
Executed: 2004-06-18
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
NO. 26, CHIN 3RD RD/, NANTZE EXPORT, PROCESSING ZONE, KAOHSIUNG, R.O.C., TAIWAN
Covered Property
(1)
Flip Chip Package Capable of Measuring Bond Line Thickness of Thermal Interface Material