Patent Assignment
Reel/Frame 015626/0170
Assignment of Assignor's Interest
Recorded: 2005-01-27
Pages: 3
Assignors
FURUKAWA, TOSHIHARU
Executed: 2004-11-22
HAKEY, MARK C.
Executed: 2004-12-02
HOLMES, STEVEN J.
Executed: 2004-12-02
HORAK, DAVID V.
Executed: 2004-12-02
KOBURGER, CHARLES W., III
Executed: 2004-11-22
MITCHELL, PETER H.
Executed: 2004-11-22
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Integrated Circuit Chip Utilizing Dielectric Layer Having Oriented Cylindrical Voids Formed from Carbon Nanotubes
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
Assignment of Assignor's Interest
Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →