Patent Assignment
Reel/Frame 015648/0095
Assignment of Assignor's Interest
Recorded: 2004-08-04
Pages: 3
Assignor
FUKUSHIMA, HIDEKO
Executed: 2004-05-10
Assignee
HITACHI METALS, LTD.
2-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Composite Material Having High Thermal Conductivity and Low Thermal Expansion Coefficient, and Heat-Dissipating Substrate, and Their Production Methods