Assignment of Assignor's Interest

Recorded: 2004-08-09 Pages: 4

Assignor

BARKEY, DALE P.

Executed: 2004-07-12

Assignee

NEXX SYSTEMS PACKAGING, LLC

5 SUBURBAN PARK DRIVE, BILLERICA, MASSACHUSETTS, 01821-3904

Covered Property (1)

Solder bumps for microelectronic packaging

Application: 60/587,350 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.