IP Library › Patent Application 60587350
Patent Application Provisional Small
App. No. 60/587,350 · Confirmation No. 6187

Solder bumps for microelectronic packaging

Inventor: Dale P. Barkey
Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2004-07-13 TRNA Transmittal of New Application 1 View
2004-07-13 SPEC Specification 6 View
2004-07-13 CLM Claims 4 View
2004-07-13 DRW Drawings-only black and white line drawings 2 View
2004-07-13 ADS Application Data Sheet 1 View
2004-07-13 WFEE Fee Worksheet (SB06) 1 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
App. No.
60/587,350
Filed
2004-07-13