Patent Assignment
Reel/Frame 015662/0547
Assignment of Assignor's Interest
Recorded: 2004-08-09
Pages: 9
Assignors
MALONEY, GERARD S.
Executed: 1999-09-03
PRICE, JASON
Executed: 1999-10-08
CHIN, SCOTT
Executed: 1999-09-03
KAJIWARA, JIRO
Executed: 1999-09-03
CHARIF, MALEK
Executed: 1999-10-12
Assignee
MITSUBISHI MATERIALS CORPORATION
1-5-1 OHTEMACHI, CHIYODA-KU, TOKYO, 100-8117, JAPAN
Covered Property
(1)
Apparatus for Chemical-Mechanical Polishing (Cmp) Head Having Direct Pneumatic Wafer Polishing Pressure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.