Assignment of Assignor's Interest

Recorded: 2005-02-16 Pages: 3

Assignor

SIEMENS AKTIENGESELLSCHAFT

Executed: 2005-02-02

Assignee

MAX-PLANCK-STRASSE 5, WARSTEIN, 59581, GERMANY

Covered Properties (4)

Method of Securing Electronic Components to a Substrate

Patent: 4,810,672 →

Application: 07/029,819 →

Method for Fastening Electronic Components to a Substrate Using a Film

Patent: 4,856,185 →

Application: 07/132,009 →

Semiconductor Component and Method for the Manufacture Thereof

Patent: 5,300,458 →

Application: 08/022,878 →

Semiconductor Component and Method for the Manufacturing Thereof

Patent: 5,436,502 →

Application: 08/327,220 →

Related Assignments (1)

Other recorded transfers of the patents in this record — the chain of ownership.