IP Library › Assignment 026358/0553
Patent Assignment
Reel/Frame 026358/0553

Merger

Recorded: 2011-05-31 Pages: 3
Assignor
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, 85579 NEUBIBERG, GERMANY
Covered Properties (30)
Method for Fixing Semiconductor Bodies on a Substrate Using Wires
Patent: 5,310,701 →
Application: 08/003,539 →
Power Diode
Patent: 5,773,858 →
Application: 08/005,760 →
Semiconductor Component and Method for the Manufacture Thereof
Patent: 5,300,458 →
Application: 08/022,878 →
Semiconductor Component and Method for the Manufacturing Thereof
Patent: 5,436,502 →
Application: 08/327,220 →
Semiconductor Module
Patent: 5,508,560 →
Application: 08/336,319 →
Semiconductor Component with Scattering Centers Within a Lateral Resistor Region
Patent: 6,043,516 →
Application: 08/940,471 →
Thyristor with Breakdown Region
Patent: 6,373,079 →
Application: 09/281,692 →
Substrate for Power Semiconductor Modules with Through-Plating of Solder and Method for Its Production
Patent: 6,715,203 →
Application: 09/789,341 →
Publication: US 2001/0022236
Spring Clip for Fixing Semiconductor Modules to a Heat Sink
Patent: 6,431,259 →
Application: 09/793,352 →
Publication: US 2001/0030037
Connecting Device for Power Semiconductor Modules with Compensation for Mechanical Stresses
Patent: 6,483,128 →
Application: 09/793,793 →
Publication: US 2001/0025964
Method for Producing a Power Semiconductor Device with a Stop Zone
Patent: 6,660,569 →
Application: 09/830,326 →
Multichip Configuration
Patent: 6,515,531 →
Application: 09/894,679 →
Publication: US 2002/0003717
Power Semiconductor Module
Patent: 6,597,585 →
Application: 09/954,411 →
Publication: US 2002/0033529
Low-Inductance Semiconductor Components
Patent: 6,809,411 →
Application: 10/023,189 →
Publication: US 2002/0089046
Lateral Semiconductor Component in Thin-Film Soi Technology
Patent: 6,693,327 →
Application: 10/074,605 →
Publication: US 2002/0121664
Circuit Configuration
Patent: 6,861,741 →
Application: 10/277,126 →
Publication: US 2003/0102506
Housing Device and Contact Element to Be Used in the Housing Device
Patent: 6,802,745 →
Application: 10/298,395 →
Publication: US 2003/0077940
Power Semiconductor Module
Patent: 6,835,994 →
Application: 10/298,396 →
Publication: US 2003/0085423
Substrate for Receiving a Circuit Configuration and Method for Producing the Substrate
Patent: 6,858,807 →
Application: 10/308,049 →
Publication: US 2003/0110627
Insulating Element
Patent: 6,943,418 →
Application: 10/372,988 →
Publication: US 2003/0151061
Body of a Semiconductor Material with a Reduced Mean Free Path Length
Patent: 6,815,793 →
Application: 10/377,071 →
Publication: US 2003/0137027
Controllable Semiconductor Component with Multi-Section Control Electrode
Patent: 6,914,296 →
Application: 10/393,165 →
Publication: US 2003/0155581
Power Semiconductor Module with Ceramic Substrate
Patent: 6,828,600 →
Application: 10/429,605 →
Publication: US 2003/0168724
High Voltage Module and Method for Producing Same
Patent: 7,078,795 →
Application: 10/742,366 →
Publication: US 2004/0140116
Semiconductor Component
Patent: 6,963,088 →
Application: 10/797,246 →
Publication: US 2004/0169256
Circuit Arrangement for Control of a Semiconductor Circuit
Patent: 7,119,586 →
Application: 10/953,099 →
Publication: US 2005/0040434
Half-Bridge Circuit with Phase Output
Patent: 7,212,063 →
Application: 10/978,930 →
Publication: US 2005/0077947
Semiconductor Module
Patent: 7,221,004 →
Application: 11/206,887 →
Publication: US 2006/0038268
Bonding Wire and Bonded Connection
Patent: 7,319,196 →
Application: 11/221,112 →
Publication: US 2006/0055041
Connection Part and Method for Producing a Connection Part
Patent: 7,147,520 →
Application: 11/234,902 →
Publication: US 2006/0068646
Related Assignments (11)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 17, 2003
From: BARTHELMESS, REINER; SCHULZE, HANS-JOACHIM
To: EUPEC EUROPAISCHE GESELLSCHAFT FUR LEISTUNGSHALBLEITER MBH & CO. KG
Reel/Frame 014597/0403 →
Assignment of Assignor's Interest Oct 20, 2003
From: HIERHOLZER, MARTIN
To: EUPEC EUROPAISCHE GESELLSCHAFT FUR LEISTUNGSHALBLEITER MBH
Reel/Frame 014605/0018 →
Assignment of Assignor's Interest Feb 6, 2004
From: STOLZE, THILO; LODDENKOETTER, MANFRED
To: EUPEC EUROPAEISCHE GESELLSCHAFT FURO LEISTUNGSHALBLEITER MBH & CO. KG
Reel/Frame 014962/0983 →
Assignment of Assignor's Interest May 24, 2004
From: KRAUSE, ELMAR; GERSTENKOEPER, HEINRICH; STRUWE, WERNER
To: EUPEC EUROPAISCHE GESELLSCHAFT FUR LEISTUNGSHALBLEITER MBH & CO. KG
Reel/Frame 015351/0380 →
Assignment of Assignor's Interest Aug 30, 2004
From: LODDENKOETTER, MANFRED
To: EUPEC EUROPAEISCHE GESELLSCHAFT FUR LEISTUNGSHALBLEITER MBH & CO. KG
Reel/Frame 015735/0954 →
Assignment of Assignor's Interest Nov 15, 2004
From: KISTNER, MICHAEL; DILLIG, REINHOLD; RAITH, SEBASTIAN; LODDENKOETTER, MANFRED
To: EUPEC EUROPAISCHE GESELLSCHAFT FUR LEISTUNGSHALBLEITER MBH & CO. KG
Reel/Frame 015982/0205 →
Assignment of Assignor's Interest Jan 11, 2005
From: FERBER, GOTTFRIED; PELMER, REIMUND
To: EUPEC EUROPAISCHE GESELLSCHAFT FUR LEISTUNGSHALBLELTER MBH & CO. KG
Reel/Frame 016148/0360 →
Assignment of Assignor's Interest Jan 25, 2005
From: LODDENKOTTER, MANFRED
To: EUPEC EUROPAISCHE GESELLSCHAFT FUR LEISTUNGSHALBLEITER MBH & CO. KG
Reel/Frame 016183/0014 →
Assignment of Assignor's Interest Feb 16, 2005
From: SIEMENS AKTIENGESELLSCHAFT
To: EUPEC EUROPAISCHE GESELLSCHAFT FUR LEISTUNGSHALBLEITER MBH
Reel/Frame 015688/0165 →
Assignment of Assignor's Interest Aug 4, 2005
From: SIEMENS AKTIENGESELLSCHAFT
To: EUPEC EUROPAEISCHE GESELLSCHAFT FUR LEISTUNGSHALBLEITER MBH
Reel/Frame 016353/0314 →
Change of Name May 31, 2011
From: EUPEC EUROPAISCHE GESELLSCHAFT FUR LEISTUNGSHALBLEITER MBH & CO KG
To: EUPEC EUROPAISCHE GESELLSCHAFT FUR LEISTUNGSHALBLEITER MBH
Reel/Frame 026357/0899 →