IP Library › Assignment 026357/0899
Patent Assignment
Reel/Frame 026357/0899

Change of Name

Recorded: 2011-05-31 Pages: 4
Assignor
Assignee
EUPEC EUROPAISCHE GESELLSCHAFT FUR LEISTUNGSHALBLEITER MBH
MAX-PLANCK-STR. 5, 59581 WARSTEIN-BELECKE, GERMANY
Covered Properties (19)
Method for Fixing Semiconductor Bodies on a Substrate Using Wires
Patent: 5,310,701 →
Application: 08/003,539 →
Power Diode
Patent: 5,773,858 →
Application: 08/005,760 →
Semiconductor Module
Patent: 5,508,560 →
Application: 08/336,319 →
Semiconductor Component with Scattering Centers Within a Lateral Resistor Region
Patent: 6,043,516 →
Application: 08/940,471 →
Thyristor with Breakdown Region
Patent: 6,373,079 →
Application: 09/281,692 →
Substrate for Power Semiconductor Modules with Through-Plating of Solder and Method for Its Production
Patent: 6,715,203 →
Application: 09/789,341 →
Publication: US 2001/0022236
Spring Clip for Fixing Semiconductor Modules to a Heat Sink
Patent: 6,431,259 →
Application: 09/793,352 →
Publication: US 2001/0030037
Connecting Device for Power Semiconductor Modules with Compensation for Mechanical Stresses
Patent: 6,483,128 →
Application: 09/793,793 →
Publication: US 2001/0025964
Method for Producing a Power Semiconductor Device with a Stop Zone
Patent: 6,660,569 →
Application: 09/830,326 →
Multichip Configuration
Patent: 6,515,531 →
Application: 09/894,679 →
Publication: US 2002/0003717
Power Semiconductor Module
Patent: 6,597,585 →
Application: 09/954,411 →
Publication: US 2002/0033529
Circuit Configuration
Patent: 6,861,741 →
Application: 10/277,126 →
Publication: US 2003/0102506
Housing Device and Contact Element to Be Used in the Housing Device
Patent: 6,802,745 →
Application: 10/298,395 →
Publication: US 2003/0077940
Substrate for Receiving a Circuit Configuration and Method for Producing the Substrate
Patent: 6,858,807 →
Application: 10/308,049 →
Publication: US 2003/0110627
Insulating Element
Patent: 6,943,418 →
Application: 10/372,988 →
Publication: US 2003/0151061
Body of a Semiconductor Material with a Reduced Mean Free Path Length
Patent: 6,815,793 →
Application: 10/377,071 →
Publication: US 2003/0137027
Controllable Semiconductor Component with Multi-Section Control Electrode
Patent: 6,914,296 →
Application: 10/393,165 →
Publication: US 2003/0155581
High Voltage Module and Method for Producing Same
Patent: 7,078,795 →
Application: 10/742,366 →
Publication: US 2004/0140116
Semiconductor Component
Patent: 6,963,088 →
Application: 10/797,246 →
Publication: US 2004/0169256
Related Assignments (9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 17, 2003
From: BARTHELMESS, REINER; SCHULZE, HANS-JOACHIM
To: EUPEC EUROPAISCHE GESELLSCHAFT FUR LEISTUNGSHALBLEITER MBH & CO. KG
Reel/Frame 014597/0403 →
Assignment of Assignor's Interest Feb 6, 2004
From: STOLZE, THILO; LODDENKOETTER, MANFRED
To: EUPEC EUROPAEISCHE GESELLSCHAFT FURO LEISTUNGSHALBLEITER MBH & CO. KG
Reel/Frame 014962/0983 →
Assignment of Assignor's Interest Mar 10, 2004
From: KELLNER-WERDEHAUSEN, UWE; NIEDERNOSTHEIDE, FRANZ-JOSEF; SCHULZE, HANS-JOACHIM; PFIRSCH, FRANK
To: EUPEC EUROPAISCHE GESELLSCHAFT FUR LEISTRUNGSHALBLEITER GMBH & CO. KG
Reel/Frame 015086/0176 →
Assignment of Assignor's Interest Apr 7, 2004
From: BAYERER, REINHOLD; LICHT, THOMAS; GABLER, VOLKER
To: EUPEC EUROPAISCHE GESELLSCHAFT FUR LEISTUNGSHALBLEITER GMBH & CO. KG
Reel/Frame 015191/0405 →
Assignment of Assignor's Interest May 24, 2004
From: KRAUSE, ELMAR; GERSTENKOEPER, HEINRICH; STRUWE, WERNER
To: EUPEC EUROPAISCHE GESELLSCHAFT FUR LEISTUNGSHALBLEITER MBH & CO. KG
Reel/Frame 015351/0380 →
Assignment of Assignor's Interest Aug 30, 2004
From: LODDENKOETTER, MANFRED
To: EUPEC EUROPAEISCHE GESELLSCHAFT FUR LEISTUNGSHALBLEITER MBH & CO. KG
Reel/Frame 015735/0954 →
Assignment of Assignor's Interest Jan 11, 2005
From: FERBER, GOTTFRIED; PELMER, REIMUND
To: EUPEC EUROPAISCHE GESELLSCHAFT FUR LEISTUNGSHALBLELTER MBH & CO. KG
Reel/Frame 016148/0360 →
Assignment of Assignor's Interest Jan 25, 2005
From: LODDENKOTTER, MANFRED
To: EUPEC EUROPAISCHE GESELLSCHAFT FUR LEISTUNGSHALBLEITER MBH & CO. KG
Reel/Frame 016183/0014 →
Merger May 31, 2011
From: EUPEC EUROPAISCHE GESELLSCHAFT FUR LEISTUNGSHALBLEITER MBH
To: INFINEON TECHNOLOGIES AG
Reel/Frame 026358/0553 →