Granted Patent
Utility
US 5,310,701 · App. 08/003,539
Method for fixing semiconductor bodies on a substrate using wires
Inventors:
Franz Kaussen, Martin Figura
Patented Case
View Patent ↗
Granted: May 10, 1994
Filed: Jan 13, 1993
Inventors
Franz Kaussen
Martin Figura
Assignee (at issue)
EUPEC Europaeische Gesellschaft fur Leistungshalbleiter mbH
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.