IP Library Granted Patent US 6,431,259
Granted Patent Utility
US 6,431,259 · Confirmation No. 2156

SPRING CLIP FOR FIXING SEMICONDUCTOR MODULES TO A HEAT SINK

⬇ PDF
Code Description Pages PDF
2001-02-26 TRNA Transmittal of New Application 1 View
2001-02-26 SPEC Specification 22 View
2001-02-26 CLM Claims 6 View
2001-02-26 ABST Abstract 1 View
2001-02-26 DRW Drawings-only black and white line drawings 6 View
2001-02-26 OATH Oath or Declaration filed 3 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
Patent No.
US 6,431,259
App. No.
09/793,352
Filed
2001-02-26
Granted
2002-08-13
Pub. No.
US20010030037A1
Examiner
DUONG, THO V
Art Unit
3743
PTA
-103 days