IP Library › Assignment 014962/0983
Patent Assignment
Reel/Frame 014962/0983

Assignment of Assignor's Interest

Recorded: 2004-02-06 Pages: 3
Assignors
STOLZE, THILO
Executed: 2001-03-16
LODDENKOETTER, MANFRED
Executed: 2001-03-18
Assignee
EUPEC EUROPAEISCHE GESELLSCHAFT FURO LEISTUNGSHALBLEITER MBH & CO. KG
MAX-PLANCK-STR. 5, WARSTEIN-BELECKE, 59581, GERMANY
Covered Property (1)
Substrate for Power Semiconductor Modules with Through-Plating of Solder and Method for Its Production
Patent: 6,715,203 →
Application: 09/789,341 →
Publication: US 2001/0022236
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 31, 2011
From: EUPEC EUROPAISCHE GESELLSCHAFT FUR LEISTUNGSHALBLEITER MBH & CO KG
To: EUPEC EUROPAISCHE GESELLSCHAFT FUR LEISTUNGSHALBLEITER MBH
Reel/Frame 026357/0899 →
Merger May 31, 2011
From: EUPEC EUROPAISCHE GESELLSCHAFT FUR LEISTUNGSHALBLEITER MBH
To: INFINEON TECHNOLOGIES AG
Reel/Frame 026358/0553 →