IP Library › Granted Patent US 6,715,203
Granted Patent Utility
US 6,715,203 · Confirmation No. 7025

SUBSTRATE FOR POWER SEMICONDUCTOR MODULES WITH THROUGH-PLATING OF SOLDER AND METHOD FOR ITS PRODUCTION

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 Code Description Pages PDF
2004-02-06 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-11-24 PA.. Power of Attorney 1 View
2003-11-24 LET. Miscellaneous Incoming Letter 1 View
2003-11-24 DRW Drawings-only black and white line drawings 4 View
2001-02-20 TRNA Transmittal of New Application 1 View
2001-02-20 SPEC Specification 12 View
2001-02-20 CLM Claims 3 View
2001-02-20 ABST Abstract 1 View
2001-02-20 DRW Drawings-only black and white line drawings 4 View
2001-02-20 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,715,203
App. No.
09/789,341
Filed
2001-02-20
Granted
2004-04-06
Pub. No.
US20010022236A1
Art Unit
3753
PTA
-149 days