Patent Assignment
Reel/Frame 015691/0236
Assignment of Assignor's Interest
Recorded: 2005-02-08
Pages: 11
Assignors
FOGEL, KEITH E.
Executed: 2004-11-12
KANG, SUNG K,
Executed: 2004-11-12
LAURO, PAUL A.
Executed: 2004-11-12
SHIH, DA-YUAN
Executed: 2004-11-15
GHOSAL, BALARAM
Executed: 2004-11-12
KILPATRICK, STEPHEN
Executed: 2004-11-15
NYE, HENRY A., III
Executed: 2004-11-15
ZUPANSKI-NIELSEN, DONNA S.
Executed: 2004-11-12
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
ARMONK, NEW YORK, 10504
Covered Property
(1)
Interconnections for Flip-Chip Using Lead-Free Solders and Having Reaction Barrier Layers
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.