Patent Assignment
Reel/Frame 015705/0877
Assignment of Assignor's Interest
Recorded: 2004-08-17
Pages: 2
Assignors
KURITA, YOICHIRO
Executed: 2004-07-15
OUCHI, RIEKA
Executed: 2004-07-15
MIYAZAKI, TAKASHI
Executed: 2004-07-15
YAMADA, TOSHIYUKI
Executed: 2004-07-15
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JAPAN
Covered Property
(1)
Flip-Chip Type Semiconductor Device, Production Process for Manufacturing Such Flip-Chip Type Semiconductor Device, and Production Process for Manufacturing Electronic Product Using Such Flip-Chip Type Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.