Patent Assignment
Reel/Frame 015710/0422
Assignment of Assignor's Interest
Recorded: 2005-02-11
Pages: 7
Assignors
WEIHS, TIMOTHY P.
Executed: 2005-01-19
KNIO, OMAR
Executed: 2005-01-18
REISS, MICHAEL
Executed: 2005-01-22
VAN HEERDEN, DAVID
Executed: 2005-01-18
FELDMESSER, HOWARD
Executed: 2005-01-26
Assignee
JOHN HOPKINS UNIVERSITY
100 NORTH CHARLES STREET, 5TH FLOOR, BALTIMORE, MARYLAND, 21201
Covered Property
(1)
Method of connecting semiconductor or microelectronic device to a substrate
Application:
10/761,685 →
Publication:
US 2004/0149372
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.