Patent Assignment
Reel/Frame 015728/0586
Assignment of Assignor's Interest
Recorded: 2004-08-20
Pages: 3
Assignors
DERDERIAN, GARO J.
Executed: 2004-08-12
WESTMORELAND, DONALD L.
Executed: 2004-08-11
UHLENBROCK, STEFAN
Executed: 2004-08-11
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83707
Covered Property
(1)
Methods for Forming Niobium and/or Vanadium Containing Layers Using Atomic Layer Deposition
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
Patent Security Agreement
Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
Corrective Assignment to Correct the Replace Erroneously Filed Patent #7358718 with the Correct Patent #7358178 Previously Recorded on Reel 038669 Frame 0001. Assignor(S) Hereby Confirms the Security Interest.
Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
Release of Security Interest
Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
Release of Security Interest
Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →