Patent Assignment
Reel/Frame 015745/0413
Assignment of Assignor's Interest
Recorded: 2004-08-31
Pages: 2
Assignors
HINODE, KENJI
Executed: 2004-08-11
NAGASAWA, SHUICHI
Executed: 2004-08-11
KITAGAWA, YOSHIHIRO
Executed: 2004-08-11
HIDAKA, MUTSUO
Executed: 2004-08-11
TANABE, KEIICHI
Executed: 2004-08-11
Assignees
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
NEC CORPORATION
7-1, SHIBA, 5-CHOME, MINATOKU, TOKYO, JAPAN
INTERNATIONAL SUPERCONDUTIVITY TECHNOLOGY CENTER, THE JURIDICAL FOUNDATION
EISHIN KAIHATSU BLDG., 5-34-3, SHINBASHI, MINATO-KU TOKYO, JAPAN
Covered Property
(1)
Manufacturing Method for Electronic Device and Multiple Layer Circuits Thereof