Patent Assignment
Reel/Frame 015775/0751
Assignment of Assignor's Interest
Recorded: 2004-09-13
Pages: 5
Assignors
BABINETZ, STEPHEN
Executed: 2004-07-27
TSUJIMURA, TAKASHI
Executed: 2004-08-13
OHTSUBO, HIROYUKI
Executed: 2004-08-13
MORIMOTO, YASUHIRO
Executed: 2004-07-30
Assignee
KULICKE AND SOFFA INVESTMENTS, INC.
2751 CENTERVILLE ROAD, SUITE 3165, LITTLE FALLS CENTER TWO, WILMINGTON, DELAWARE, 19808
Covered Property
(1)
Method and Apparatus for Forming Bumps for Semiconductor Interconnections Using a Wire Bonding Machine
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.