IP Library Assignment 017752/0052
Patent Assignment
Reel/Frame 017752/0052

Merger

Recorded: 2006-06-09 Pages: 6
Assignor
KULICKE & SOFFA INVESTMENTS, INC.
Executed: 2005-10-21
Assignee
KULICKE AND SOFFA INDUSTRIES, INC.
1005 VIRGINIA DRIVE, FORT WASHINGTON, PENNSYLVANIA, 19034
Covered Property (1)
Method and Apparatus for Forming Bumps for Semiconductor Interconnections Using a Wire Bonding Machine
Patent: 7,229,906 →
Application: 10/247,242 →
Publication: US 2004/0152292
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 13, 2004
From: BABINETZ, STEPHEN; TSUJIMURA, TAKASHI; OHTSUBO, HIROYUKI; MORIMOTO, YASUHIRO
To: KULICKE AND SOFFA INVESTMENTS, INC.
Reel/Frame 015775/0751 →