Assignment of Assignor's Interest

Recorded: 2004-09-20 Pages: 3

Assignor

RYU, HYUN KYU

Executed: 2004-06-11

Assignee

HYNIX SEMICONDUCTOR INC.

SAN 136-1, AMI-RI, BUBAL-UEP, ICHON-SHI, KYUNGKI-DO, KOREA, REPUBLIC OF

Covered Property (1)

Method for forming metal wiring in semiconductor device

Application: 10/879,785 →

Publication: US 2005/0142847

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.