IP Library › Assignment 015801/0886
Patent Assignment
Reel/Frame 015801/0886

Assignment of Assignor's Interest

Recorded: 2004-09-13 Pages: 4
Assignors
YAO, CHIH-HSIANG
Executed: 2004-09-01
HUANG, TAI-CHUN
Executed: 2004-09-01
CHI, KUAN-SHOU
Executed: 2004-09-01
JENG, CHIH-CHERNG
Executed: 2004-09-01
LIANG, MING-SHUOH
Executed: 2004-09-01
WAN, WEN-KAI
Executed: 2004-09-01
HSIA, CHIN-CHIU
Executed: 2004-09-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6,, SCIENCE BASED INDUSTRIAL PARK, HSIN-CHU, ROC 300-77, TAIWAN
Covered Property (1)
Seal Ring Structure for Integrated Circuit Chips
Patent: 7,777,338 →
Application: 10/940,504 →
Publication: US 2006/0055007
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 8, 2010
From: YAO, CHIH-HSIANG; HUANG, TAI-CHUN; CHI, KUAN-SHOU; JENG, CHIH-CHERNG
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 024655/0020 →