Patent Assignment
Reel/Frame 015803/0492
Assignment of Assignor's Interest
Recorded: 2004-09-13
Pages: 4
Assignors
LIN, TZU-HAN
Executed: 2004-07-29
YU, HUEI-MEI
Executed: 2004-07-29
CHENG, CHIA-JEN
Executed: 2004-07-29
LO, CHUN-YEN
Executed: 2004-07-28
TSENG,LI-HSIN
Executed: 2004-07-29
SU, BOE
Executed: 2004-07-29
LU,SIMON
Executed: 2004-08-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Bump Structure