Patent Assignment
Reel/Frame 015818/0245
Assignment of Assignor's Interest
Recorded: 2004-03-08
Pages: 4
Assignor
ICHIMIYA, JUNJI
Executed: 2003-11-12
Assignee
RICOH COMPANY, LTD.
3-6, NAKAMAGOME 1-CHOME, OHTA-KU, TOKYO 143-8555, JAPAN
Covered Property
(1)
Layout Design Method of Semiconductor Integrated Circuit, and Semiconductor Integrated Circuit, with High Integration Level of Multiple Level Metalization