IP Library › Assignment 015824/0553
Patent Assignment
Reel/Frame 015824/0553

Assignment of Assignor's Interest

Recorded: 2004-09-13 Pages: 3
Assignors
WAKISAKA, SHINJI
Executed: 2004-09-03
JOBETTO, HIROYASU
Executed: 2004-09-03
Assignee
CASIO COMPUTER CO., LTD.
6-2, HON-MACHI 1-CHOME, SHIBUYA-KU, TOKYO, JAPAN
Covered Property (1)
Semiconductor Device Having Heat Dissipation Layer
Patent: 7,042,081 →
Application: 10/940,232 →
Publication: US 2005/0062147
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 22, 2007
From: CASIO COMPUTER CO., LTD.
To: CMK CORPORATION
Reel/Frame 019055/0768 →
Change of Ownership by Corporate Separation Jan 3, 2012
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027465/0812 →
Change of Ownership by Corporate Separation-to Correct Assignee's Address on Reel 027465, Frame 0812 Jan 6, 2012
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027492/0449 →
Merger Nov 30, 2016
From: TERAMIKROS, INC.
To: TERA PROBE, INC.
Reel/Frame 040769/0853 →
Assignment of Assignor's Interest Jan 30, 2017
From: TERA PROBE, INC.
To: AOI ELECTRONICS CO., LTD.
Reel/Frame 041123/0931 →