Patent Assignment
Reel/Frame 027465/0812
Change of Ownership by Corporate Separation
Recorded: 2012-01-03
Pages: 4
Assignor
CASIO COMPUTER CO., LTD.
Executed: 2011-12-12
Assignee
TERAMIKROS, INC.
6-2, HON-MACHI 1-CHOME, SHIBUYA-KU, TOKYO 151-8543, JAPAN
Covered Properties
(62)
Method of Manufacturing Semiconductor Device Using Dry Photoresist Film
Patent:
6,140,155 →
Application:
09/459,019 →
Method for packaging semiconductor device having bump electrodes
Patent:
6,319,851 →
Application:
09/487,165 →
A Mounting Structure Having Columnar Electrodes and a Sealing Film
Semiconductor Device
Patent:
6,545,354 →
Application:
09/499,599 →
Semiconductor Device Having Sealing Film Formed on the Surface Having Columnar Electrode Formed Thereon and Method of Manufacturing the Same
Patent:
6,472,249 →
Application:
09/630,677 →
Semiconductor Device and Method of Manufacturing the Same
Patent:
6,607,970 →
Application:
09/704,156 →
Semiconductor Device Which Prevents Leakage of Noise Generated in a Circuit Element Forming Area and Which Shields Against External Ellectromagnetic Noise
Patent:
6,501,169 →
Application:
09/708,379 →
Method of Manufacturing Semiconductor Device Having Sealing Film on Its Surface
Patent:
6,467,674 →
Application:
09/722,943 →
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device Having Thin Film Passive Element
Semiconductor Device Having a Chip Size Package Including a Passive Element
Method for Production of Semiconductor Package
Patent:
38,961 →
Application:
10/150,379 →
Semiconductor Device and Method of Fabricating the Same
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Package and Method of Fabricating the Same
Wiring Structure on Semiconductor Substrate and Method of Fabricating the Same
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Package Having Semiconductor Constructing Body and Method of Manufacturing the Same
Semiconductor Package Including Connected Upper and Lower Interconnections
High Frequency Signal Transmission Structure
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device Having Heat Dissipation Layer
Semiconductor Device Including a Hard Sheet to Reduce Warping of a Base Plate and Method of Fabricating the Same
Method of Fabricating a Semiconductor Package Utilizing a Thermosetting Resin Base Member
Semiconductor Device Having Conducting Portion of Upper and Lower Conductive Layers
Semiconductor Device
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device Incorporating a Semiconductor Constructing Body and an Interconnecting Layer Which Is Connected to a Ground Layer via a Vertical Conducting Portion
Semiconductor Device Having Adhesion Increasing Film to Prevent Peeling
Semiconductor Device Packaged into Chip Size and Manufacturing Method Thereof
Semiconductor Device and Manufacturing Method Thereof
Semiconductor Device and Manufacturing Method Thereof
Semiconductor Package Having Semiconductor Constructing Body and Method of Manufacturing the Same
Semiconductor Device Having Reduced Number of External Pad Portions
Semiconductor Device Including a Base Member and a Semiconductor Constructing Body Directly Fixed to Thermosetting Resin of the Base Member
Semiconductor Device Comprising a Plurality of Semiconductor Constructs
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device Having Low Dielectric Insulating Film and Manufacturing Method of the Same
Semiconductor Device
Circuit Board, Semiconductor Device, and Manufacturing Method of Circuit Board
Semiconductor Device Having Alignment Post Electrode and Method of Manufacturing the Same
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device and Method of Manufacturing the Same
Method of Manufacturing Semiconductor Device
Semiconductor Device Having a Thin-Film Circuit Element Provided Above an Integrated Circuit
Patent:
41,511 →
Application:
11/726,763 →
Semiconductor Device Having Adhesion Increasing Film to Prevent Peeling
Method of Fabricating a Semiconductor Device Including Forming an Insulating Layer with a Hard Sheet Buried Therein
Semiconductor Device and Method of Manufacturing the Same
Patent:
41,369 →
Application:
11/788,397 →
Chip-Type Electronic Component Including Thin-Film Circuit Elements
Method of Fabricating Semiconductor Device Having Conducting Portion of Upper and Lower Conductive Layers on a Peripheral Surface of the Semiconductor Device
Method of Fabricating a Semiconductor Device Incorporating a Semiconductor Constructing Body and an Interconnecting Layer Which Is Connected to a Ground Layer via a Vertical Conducting Portion
Semiconductor Device Having Projecting Electrode Formed by Electrolytic Plating, and Manufacturing Method Thereof
Semiconductor Device with No Base Member and Method of Manufacturing the Same
Semiconductor Package Including Connected Upper and Lower Interconnections, and Manufacturing Method Thereof
Semiconductor Device Comprising Circuit Substrate with Inspection Connection Pads and Manufacturing Method Thereof
Semiconductor Device Including Semiconductor Constituent and Manufacturing Method Thereof
Semiconductor Device Packaged into Chip Size and Manufacturing Method Thereof
Method of Manufacturing Semiconductor Device Having Semiconductor Formation Regions of Different Planar Sizes
Semiconductor Device Having Wiring Line and Manufacturing Method Thereof
Semiconductor Device Having Wiring Line and Manufacturing Method Thereof
Semiconductor Device and Method of Manufacturing the Same
Related Assignments
(20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 8, 2001
From: TAHARA, IWAO; MIHARA, ICHIRO; AOKI, YUTAKA
To: INTEGRATED ELECTRONICS & PACKAGING TECHNOLOGIES, INC.; CASIO COMPUTER CO., LTD.
Reel/Frame 012069/0768 →
Assignment of Assignor's Interest
Jun 10, 2003
From: KOUNO, ICHIRO; OKADA, OSAMU
To: CASIO COMPUTER CO., LTD.
Reel/Frame 014185/0539 →
Assignment of Assignor's Interest
Sep 15, 2003
From: JOBETTO, HIROYASU
To: CASIO COMPUTER CO., LTD.
Reel/Frame 014516/0403 →
Assignment of Assignor's Interest
Sep 23, 2003
From: WAKABAYASHI, TAKESHI; MIHARA, ICHIRO
To: CASIO COMPUTER CO., LTD.
Reel/Frame 014989/0676 →
Assignment of Assignor's Interest
Nov 3, 2003
From: MATSUZAKI, TOMIO; ARAI, KAZUYOSHI
To: CASIO COMPUTER CO., LTD.
Reel/Frame 014642/0687 →
Assignment of Assignor's Interest
Apr 16, 2004
From: JOBETTO, HIROYASU; MIHARA, ICHIRO
To: CASIO COMPUTER CO., LTD.
Reel/Frame 015229/0508 →
Assignment of Assignor's Interest
May 20, 2004
From: WAKABAYASHI, TAKESHI; WAKISAKA, SHINJI
To: CASIO COMPUTER CO., LTD.
Reel/Frame 015396/0221 →
Assignment of Assignor's Interest
Jun 2, 2004
From: JOBETTO, HIROYASU
To: CASIO COMPUTER CO., LTD.
Reel/Frame 015439/0863 →
Assignment of Assignor's Interest
Jun 30, 2004
From: AOKI, YUTAKA; NISHIKADO, SAYAKA
To: CASIO COMPUTER CO., LTD.
Reel/Frame 015544/0076 →
Assignment of Assignor's Interest
Apr 27, 2007
From: CASIO COMPUTER CO., LTD.
To: CMK CORPORATION
Reel/Frame 019225/0615 →
Change of Name
Dec 18, 2008
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022038/0711 →
Change of Name
Jan 6, 2012
From: OKI SEMICONDUCTOR CO., LTD.
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 027493/0207 →
Change of Ownership by Corporate Separation-to Correct Assignee's Address on Reel 027465, Frame 0812
Jan 6, 2012
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027492/0449 →
Change of Address
Mar 21, 2014
From: LAPIS SEMICONDUCTOR CO., LTD.,
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0049 →
Merger
Nov 23, 2016
From: TERA PROBE, INC.
To: OUME ELECTRONICS CO., LTD.
Reel/Frame 040413/0559 →
Merger
Nov 30, 2016
From: TERAMIKROS, INC.
To: TERA PROBE, INC.
Reel/Frame 040772/0440 →
Merger
Dec 20, 2016
From: TERAMIKROS, INC.
To: TERA PROBE, INC.
Reel/Frame 041038/0117 →
Assignment of Assignor's Interest
Jan 27, 2017
From: TERA PROBE, INC.
To: AOI ELECTRONICS CO., LTD.
Reel/Frame 041521/0001 →
Merger
Jan 27, 2017
From: TERAMIKROS, INC.
To: TERA PROBE, INC.
Reel/Frame 041664/0471 →
Assignment of Assignor's Interest
Feb 3, 2017
From: TERA PROBE, INC.
To: AOI ELECTRONICS CO., LTD.
Reel/Frame 041169/0952 →