Patent Assignment
Reel/Frame 019225/0615
Assignment of Assignor's Interest
Recorded: 2007-04-27
Pages: 2
Assignor
CASIO COMPUTER CO., LTD.
Executed: 2007-03-09
Assignee
CMK CORPORATION
5-1, NISHISHINJUKU 6-CHOME, SHINJUKU-KU, TOKYO, 1631388, JAPAN
Covered Properties
(4)
Semiconductor Package Including Connected Upper and Lower Interconnections
Semiconductor Device Including a Hard Sheet to Reduce Warping of a Base Plate and Method of Fabricating the Same
Semiconductor Device Incorporating a Semiconductor Constructing Body and an Interconnecting Layer Which Is Connected to a Ground Layer via a Vertical Conducting Portion
Semiconductor Device Having Adhesion Increasing Film to Prevent Peeling
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 2, 2004
From: JOBETTO, HIROYASU
To: CASIO COMPUTER CO., LTD.
Reel/Frame 015439/0863 →
Assignment of Assignor's Interest
Dec 20, 2004
From: JOBETTO, HIROYASU
To: CASIO COMPUTER CO., LTD.
Reel/Frame 016119/0426 →
Assignment of Assignor's Interest
Mar 30, 2005
From: JOBETTO, HIROYASU
To: CASIO COMPUTER CO., LTD.
Reel/Frame 016439/0608 →
Assignment of Assignor's Interest
Jun 1, 2005
From: OKADA, OSAMU; JOBETTO, HIROYASU
To: CASICO COMPUTER CO., LTD.
Reel/Frame 016656/0646 →
Change of Ownership by Corporate Separation
Jan 3, 2012
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027465/0812 →
Change of Ownership by Corporate Separation-to Correct Assignee's Address on Reel 027465, Frame 0812
Jan 6, 2012
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027492/0449 →