Chip-type electronic component including thin-film circuit elements
View Patent ↗A chip-type electronic component includes a substrate, a common potential layer formed on an upper side of the substrate, an insulating film formed on the common potential layer, and provided to expose at least part of the common potential layer. At least one common potential electrode is provided on the exposed part of the common potential layer, and a plurality of conductors provided on the insulating film, each of the conductors forming a part of a thin-film circuit element. At least one columnar electrode is electrically connected to at least one of the conductors, and a sealing film is formed around the columnar electrode.
1. A chip-type electronic component comprising:
a substrate;
a common potential layer formed on an upper side of the substrate;
an insulating film formed on the common potential layer, and provided to expose at least part of the common potential layer;
at least one common potential electrode provided on the part of the common potential layer;
a plurality of conductors provided on the insulating film, each of the conductors being constituted as a part of a thin-film circuit element;
at least one conducting columnar electrode electrically connected to at least one of the conductors; and
a sealing film formed around the conducting columnar electrode.
2. The component according to claim 1 , wherein the substrate includes a semiconductor substrate having an integrated circuit.
3. The component according to claim 1 , wherein the common potential layer is provided on the entire upper side of the substrate, and the common potential electrode is provided on a peripheral area of the common potential layer, and the insulating film is provided in a center area of the common potential layer, enclosed by the peripheral area.
4. The component according to claim 1 , wherein each of the thin-film circuit elements includes a thin-film capacitive element including the conductor, the common potential layer, and the insulating film provided between the conductor and the common potential layer.
5. The component according to claim 1 , wherein each of the conductors includes a metal lower layer and a metal upper layer.
6. The component according to claim 1 , wherein each of the thin-film circuit elements includes a thin-film inductive element comprising a conductor element, which is spirally formed on the insulating film.
7. The component according to claim 6 , wherein each of the conductor elements includes a metal lower layer and a metal upper layer.
8. The component according to claim 6 , wherein one end of the thin-film inductive element is connected to the conducting columnar electrode, and the other end thereof is connected to the common potential layer via an opening formed in the insulating film.
9. The component according to claim 1 , wherein each of the thin-film circuit elements includes a thin-film inductive element comprising the conductor windingly formed on the insulating film.
10. The component according to claim 9 , wherein each of the conductors includes a metal lower layer and a metal upper layer.
11. The component according to claim 1 , wherein said at least one common potential electrode includes a ground connection pad provided on the common potential layer and a ground columnar electrode provided on the ground connection pad.
12. The component according to claim 1 , wherein said plurality of thin-film circuit elements are the same kind of circuit elements.
13. The component according to claim 1 , wherein said plurality of thin-film circuit elements are different kinds of circuit elements.
14. The component according to claim 1 , wherein upper surfaces of the common potential electrode and the conducting columnar electrode are respectively provided with solder layers.