Patent Assignment
Reel/Frame 041521/0001
Assignment of Assignor's Interest
Recorded: 2017-01-27
Pages: 6
Assignor
TERA PROBE, INC.
Executed: 2016-11-28
Assignee
AOI ELECTRONICS CO., LTD.
455-1, KOHZAI-MINAMIMACHI, TAKAMATSU-SHI, KAGAWA, 761-8014, JAPAN
Covered Properties
(50)
Method of Manufacturing Semiconductor Device Using Dry Photoresist Film
Patent:
6,140,155 →
Application:
09/459,019 →
Method for packaging semiconductor device having bump electrodes
Patent:
6,319,851 →
Application:
09/487,165 →
A Mounting Structure Having Columnar Electrodes and a Sealing Film
Semiconductor Device
Patent:
6,545,354 →
Application:
09/499,599 →
Semiconductor Device Having Sealing Film Formed on the Surface Having Columnar Electrode Formed Thereon and Method of Manufacturing the Same
Patent:
6,472,249 →
Application:
09/630,677 →
Semiconductor Device and Method of Manufacturing the Same
Patent:
6,607,970 →
Application:
09/704,156 →
Semiconductor Device Which Prevents Leakage of Noise Generated in a Circuit Element Forming Area and Which Shields Against External Ellectromagnetic Noise
Patent:
6,501,169 →
Application:
09/708,379 →
Method of Manufacturing Semiconductor Device Having Sealing Film on Its Surface
Patent:
6,467,674 →
Application:
09/722,943 →
Resin Film Forming Method and Resin Film Forming Apparatus Employing Said Method
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Package and Method of Fabricating the Same
Wiring Structure on Semiconductor Substrate and Method of Fabricating the Same
Semiconductor Package Having Semiconductor Constructing Body and Method of Manufacturing the Same
Semiconductor Package Having Built-in Micro Electric Mechanical System and Manufacturing Method Thereof
Method of Fabricating a Semiconductor Package Utilizing a Thermosetting Resin Base Member
Semiconductor Device Having Conducting Portion of Upper and Lower Conductive Layers
Semiconductor Device
Semiconductor Device and Method of Manufacturing the Same
Optical Sensor Module with Semiconductor Device for Drive
Semiconductor Package Having Semiconductor Constructing Body and Method of Manufacturing the Same
Semiconductor Device Having Reduced Number of External Pad Portions
Semiconductor Device Including a Base Member and a Semiconductor Constructing Body Directly Fixed to Thermosetting Resin of the Base Member
Semiconductor Device Having Shield Structure
Semiconductor Device Comprising a Plurality of Semiconductor Constructs
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device Having Low Dielectric Insulating Film and Manufacturing Method of the Same
Semiconductor Device
Circuit Board, Semiconductor Device, and Manufacturing Method of Circuit Board
Semiconductor Device Having Alignment Post Electrode and Method of Manufacturing the Same
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device and Method of Manufacturing the Same
Method of Manufacturing Semiconductor Device
Semiconductor Device and Method of Manufacturing the Same
Patent:
41,369 →
Application:
11/788,397 →
Chip-Type Electronic Component Including Thin-Film Circuit Elements
Semiconductor Device Including Semiconductor Element Surrounded by an Insulating Member and Wiring Structures on Upper and Lower Surfaces of the Semiconductor Element and Insulating Member, and Manufacturing Method Thereof
Semiconductor Device Including Semiconductor Element Surrounded by an Insulating Member and Wiring Structures on Upper and Lower Surfaces of the Semiconductor Element and Insulating Member, and Manufacturing Method Thereof
Method of Fabricating Semiconductor Device Having Conducting Portion of Upper and Lower Conductive Layers on a Peripheral Surface of the Semiconductor Device
Semiconductor Device Having Semiconductor Structure Bodies on Upper and Lower Surfaces Thereof, and Method of Manufacturing the Same
Semiconductor Device with Magnetic Powder Mixed Therein and Manufacturing Method Thereof
Semiconductor Device Comprising Circuit Substrate with Inspection Connection Pads and Manufacturing Method Thereof
Semiconductor Device Including Semiconductor Constituent and Manufacturing Method Thereof
Semiconductor Device Packaged into Chip Size and Manufacturing Method Thereof
Semiconductor Device and Method of Manufacturing the Same
Method of Forming Wiring on a Plurality of Semiconductor Devices from a Single Metal Plate, and a Semiconductor Construction Assembly Formed by the Method
Semiconductor Device Including Semiconductor Constituent
Semiconductor Device Provided with Tin Diffusion Inhibiting Layer, and Manufacturing Method of the Same
Semiconductor Structure, Manufacturing Method of Semiconductor Structure and Semiconductor Device
Semiconductor Structure and Manufacturing Method of Semiconductor Structure
Semiconductor Device and Manufacturing Method of the Same
Related Assignments
(15)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 15, 2003
From: JOBETTO, HIROYASU
To: CASIO COMPUTER CO., LTD.
Reel/Frame 014516/0403 →
Assignment of Assignor's Interest
Sep 23, 2003
From: WAKABAYASHI, TAKESHI; MIHARA, ICHIRO
To: CASIO COMPUTER CO., LTD.
Reel/Frame 014989/0676 →
Assignment of Assignor's Interest
Nov 3, 2003
From: MATSUZAKI, TOMIO; ARAI, KAZUYOSHI
To: CASIO COMPUTER CO., LTD.
Reel/Frame 014642/0687 →
Assignment of Assignor's Interest
May 20, 2004
From: WAKABAYASHI, TAKESHI; WAKISAKA, SHINJI
To: CASIO COMPUTER CO., LTD.
Reel/Frame 015396/0221 →
Assignment of Assignor's Interest
Jun 22, 2004
From: AOKI, YUTAKA
To: CASIO COMPUTER CO., LTD.
Reel/Frame 015512/0409 →
Assignment of Assignor's Interest
Jan 18, 2005
From: MIHARA, ICHIRO
To: CASIO COMPUTER CO., LTD.
Reel/Frame 016202/0987 →
Assignment of Assignor's Interest
Jan 21, 2005
From: JOBETTO, HIROYASU
To: CASIO COMPUTER CO., LTD.
Reel/Frame 016222/0597 →
Assignment of Assignor's Interest
Jan 21, 2005
From: JOBETTO, HIROYASU; MIHARA, ICHIRO
To: CASIO COMPUTER CO., LTD.
Reel/Frame 016510/0296 →
Assignment of Assignor's Interest
Nov 28, 2011
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027287/0635 →
Change of Ownership by Corporate Separation
Jan 3, 2012
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027469/0224 →
Change of Ownership by Corporate Separation
Jan 3, 2012
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027465/0812 →
Change of Ownership by Corporate Separation-to Correct Assignee's Address on Reel 027465, Frame 0812
Jan 6, 2012
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027492/0449 →
Change of Ownership by Corporate Separation
Jan 6, 2012
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027490/0809 →
Change of Address
Jan 17, 2012
From: CASIO MICRONICS CO., LTD.
To: CASIO MICRONICS CO., LTD.
Reel/Frame 027544/0435 →
Merger
Jan 27, 2017
From: TERAMIKROS, INC.
To: TERA PROBE, INC.
Reel/Frame 041664/0471 →