Semiconductor structure and manufacturing method of semiconductor structure

1. A semiconductor structure, comprising:

a semiconductor substrate including an electronic circuit which is provided in a predetermined region of the semiconductor substrate;

a wall which is formed to encircle the predetermined region of the semiconductor substrate;

a wiring provided in a region of the semiconductor substrate outside of the predetermined region of the semiconductor substrate;

an external connection electrode provided on the wiring;

a sealing resin which seals the wiring, the sealing resin being filled in a region of the semiconductor substrate outside of the wall; and

a transparent resin to seal the predetermined region of the semiconductor substrate, the transparent resin being filled inside of the wall;

wherein the wall and the external connection electrode are formed of a same material.

2. The semiconductor structure according to claim 1 , wherein the wall and the external connection electrode have a same height level.

3. The semiconductor structure according to claim 1 , wherein a protective insulating film intervenes between the wall and the semiconductor substrate.

4. The semiconductor structure according to claim 1 , wherein the wall is grounded.

5. The semiconductor structure according to claim 4 , wherein the semiconductor substrate includes a connection pad for grounding and the connection pad for grounding is connected to the wall via a wiring for grounding.

6. The semiconductor structure according to claim 1 , wherein the external connection electrode is connected with an external circuit board.

7. The semiconductor structure according to claim 6 , wherein a solder terminal is provided between the external connection electrode and the external circuit board.

8. The semiconductor structure according to claim 6 , wherein a part of the external circuit board corresponding to the predetermined region of the semiconductor substrate forms an opening.