IP Library › Assignment 016202/0987
Patent Assignment
Reel/Frame 016202/0987

Assignment of Assignor's Interest

Recorded: 2005-01-18 Pages: 3
Assignor
MIHARA, ICHIRO
Executed: 2005-01-07
Assignee
CASIO COMPUTER CO., LTD.
6-2, HON-MACHI 1-CHOME, SHIBUYA-KU, TOKYO 151-8543, JAPAN
Covered Property (1)
Method of Fabricating a Semiconductor Package Utilizing a Thermosetting Resin Base Member
Patent: 7,112,469 →
Application: 11/037,423 →
Publication: US 2005/0161803
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Ownership by Corporate Separation Jan 3, 2012
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027465/0812 →
Change of Ownership by Corporate Separation-to Correct Assignee's Address on Reel 027465, Frame 0812 Jan 6, 2012
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027492/0449 →
Assignment of Assignor's Interest Jan 27, 2017
From: TERA PROBE, INC.
To: AOI ELECTRONICS CO., LTD.
Reel/Frame 041521/0001 →
Merger Jan 27, 2017
From: TERAMIKROS, INC.
To: TERA PROBE, INC.
Reel/Frame 041664/0471 →