Patent Assignment
Reel/Frame 027287/0635
Assignment of Assignor's Interest
Recorded: 2011-11-28
Pages: 4
Assignor
CASIO COMPUTER CO., LTD.
Executed: 2011-11-17
Assignee
TERAMIKROS, INC.
10-6, IMAI 3-CHOME, OME-SHI,, TOKYO,, 198-8555, JAPAN
Covered Properties
(12)
Semiconductor Package Having Built-in Micro Electric Mechanical System and Manufacturing Method Thereof
Semiconductor Device Including Semiconductor Element Surrounded by an Insulating Member and Wiring Structures on Upper and Lower Surfaces of the Smeiconductor Element and Insulating Member, and Manufacturing Method Thereof
Semiconductor Device with Increased Number of External Connection Electrodes
Network Electronic Component, Semiconductor Device Incorporating Network Electronic Component, and Methods of Manufacturing Both
Semiconductor Device Having Shield Structure
Semiconductor device having strong adhesion between wiring and protective film, and manufacturing method therefor
Application:
11/524,455 →
Publication:
US 2007/0085224
Grounding Structure of Semiconductor Device Including a Conductive Paste
Semiconductor Device Including Semiconductor Element Surrounded by an Insulating Member and Wiring Structures on Upper and Lower Surfaces of the Semiconductor Element and Insulating Member, and Manufacturing Method Thereof
Semiconductor Device Including Semiconductor Element Surrounded by an Insulating Member and Wiring Structures on Upper and Lower Surfaces of the Semiconductor Element and Insulating Member, and Manufacturing Method Thereof
Semiconductor device equipped with thin-film circuit elements
Application:
12/072,210 →
Publication:
US 2008/0203526
Semiconductor Device and Manufacturing Method Thereof, Multilayer Re-Wirings, Columnar Electrode
Application:
12/072,833 →
Publication:
US 2008/0203569
Semiconductor Device Including Semiconductor Element Surrounded by an Insulating Member and Wiring Structures on Upper and Lower Surfaces of the Semiconductor Element and Insulating Member, and Manufacturing Method Thereof
Patent:
43,380 →
Application:
12/775,378 →
Related Assignments
(11)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 22, 2004
From: AOKI, YUTAKA
To: CASIO COMPUTER CO., LTD.
Reel/Frame 015512/0409 →
Assignment of Assignor's Interest
Nov 10, 2004
From: WAKISAKA, SHINJI; JOBETTO, HIROYASU; WAKABAYASHI, TAKESHI; MIHARA, ICHIRO
To: CASIO COMPUTER CO., LTD.
Reel/Frame 015984/0730 →
Assignment of Assignor's Interest
Mar 11, 2005
From: WAKISAKA, SHINJI; JOBETTO, HIROYASU
To: CASIO COMPUTER CO., LTD.
Reel/Frame 016390/0600 →
Assignment of Assignor's Interest
Mar 30, 2005
From: WAKISAKA, SHINJI
To: CASIO COMPUTER CO., LTD.
Reel/Frame 016441/0411 →
Assignment of Assignor's Interest
Sep 13, 2006
From: SUGIMOTO, SADAYUKI
To: CASIO COMPUTER CO., LTD.
Reel/Frame 018312/0114 →
Assignment of Assignor's Interest
Sep 20, 2006
From: KOUNO, ICHIRO; OKADA, OSAMU
To: CASIO COMPUTER CO., LTD.
Reel/Frame 018325/0363 →
Assignment of Assignor's Interest
Mar 29, 2007
From: WAKABAYASHI, TAKESHI; MIHARA, ICHIRO; OKADA, OSAMU
To: CASIO COMPUTER CO., LTD.
Reel/Frame 019174/0519 →
Assignment of Assignor's Interest
Feb 25, 2008
From: MIHARA, ICHIRO
To: CASIO COMPUTER CO., LTD.
Reel/Frame 020613/0882 →
Assignment of Assignor's Interest
Feb 28, 2008
From: MIYAMOTO, TSUTOMU
To: CASIO COMPUTER CO., LTD.
Reel/Frame 020626/0509 →
Assignment of Assignor's Interest
Jan 27, 2017
From: TERA PROBE, INC.
To: AOI ELECTRONICS CO., LTD.
Reel/Frame 041521/0001 →
Merger
Jan 27, 2017
From: TERAMIKROS, INC.
To: TERA PROBE, INC.
Reel/Frame 041664/0471 →