Patent Assignment
Reel/Frame 015984/0730
Assignment of Assignor's Interest
Recorded: 2004-11-10
Pages: 2
Assignors
WAKISAKA, SHINJI
Executed: 2004-11-09
JOBETTO, HIROYASU
Executed: 2004-11-09
WAKABAYASHI, TAKESHI
Executed: 2004-11-09
MIHARA, ICHIRO
Executed: 2004-11-09
Assignee
CASIO COMPUTER CO., LTD.
6-2, HON-MACHI 1-CHOME,, SHIBUYA-KU, TOKYO, 151-8543, JAPAN
Covered Property
(1)
Semiconductor Device Including Semiconductor Element Surrounded by an Insulating Member and Wiring Structures on Upper and Lower Surfaces of the Smeiconductor Element and Insulating Member, and Manufacturing Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.