Patent Assignment
Reel/Frame 018325/0363
Assignment of Assignor's Interest
Recorded: 2006-09-20
Pages: 2
Assignee
CASIO COMPUTER CO., LTD.
6-2, HON-MACHI 1-CHOME, SHIBUYA-KU, TOKYO 151-8543, JAPAN
Covered Property
(1)
Semiconductor device having strong adhesion between wiring and protective film, and manufacturing method therefor
Application:
11/524,455 →
Publication:
US 2007/0085224
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.