IP Library Assignment 019174/0519
Patent Assignment
Reel/Frame 019174/0519

Assignment of Assignor's Interest

Recorded: 2007-03-29 Pages: 2
Assignors
WAKABAYASHI, TAKESHI
Executed: 2007-03-12
MIHARA, ICHIRO
Executed: 2007-03-12
OKADA, OSAMU
Executed: 2007-03-12
Assignee
CASIO COMPUTER CO., LTD.
6-2, HON-MACHI 1-CHOME, SHIBUYA-KU, TOKYO 151-8543, JAPAN
Covered Property (1)
Grounding Structure of Semiconductor Device Including a Conductive Paste
Patent: 7,592,672 →
Application: 11/729,650 →
Publication: US 2007/0228468
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 28, 2011
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027287/0635 →