Semiconductor device including semiconductor constituent and manufacturing method thereof
View Patent ↗A semiconductor device includes a semiconductor constituent having a semiconductor substrate and a plurality of electrodes for external connection provided under the semiconductor substrate. An under-layer insulating film is provided under and around the semiconductor constituent. A plurality of under-layer wires are provided under the under-layer insulating film and electrically connected to the electrodes for external connection of the semiconductor constituent. An insulating layer is provided around the semiconductor constituent and on the under-layer insulating film. A frame-like insulating substrate is embedded in an upper surface of the insulating layer and positioned around the semiconductor constituent. A plurality of upper-layer wires are provided on the insulating substrate. A base plate on which the semiconductor constituent and the insulating layer are mounted is removed.
1. A manufacturing method of a semiconductor device, comprising:
forming an under-layer insulating film on a base plate;
securing, onto the under-layer insulating film, a plurality of semiconductor constituents each having a semiconductor substrate and a plurality of electrodes for external connection provided under the semiconductor substrate;
forming an insulating layer on the under-layer insulating film around the semiconductor constituents, and embedding a frame-like insulating substrate in an upper surface of the insulating layer;
removing the base plate;
connecting under-layer wires to the electrodes for external connection of the semiconductor constituent under the under-layer insulating film; and
cutting the under-layer insulating film, the insulating layer and the insulating substrate between the semiconductor constituents to obtain a plurality of semiconductor devices,
wherein each of semiconductor devices has an upper-layer wire formed on the insulating substrate.
2. The manufacturing method of the semiconductor device according to claim 1 , wherein the removing the base plate is performed by etching.
3. The manufacturing method of the semiconductor device according to claim 2 , wherein the base plate is made of a metal foil, and the removing the base plate is performed by wet etching of using an etching solution.
4. The manufacturing method of the semiconductor device according to claim 1 , wherein the securing the semiconductor constituent onto the under-layer insulating film includes beforehand supplying an adhesive material onto the under-layer insulating film and heating/pressurizing the semiconductor constituent on the under-layer insulating film.
5. The manufacturing method of the semiconductor device according to claim 1 , wherein the securing the semiconductor constituent onto the under-layer insulating film includes beforehand supplying an adhesive sheet onto the under-layer insulating film and heating/pressurizing the semiconductor constituent on the under-layer insulating film.
6. The manufacturing method of the semiconductor device according to claim 1 , wherein the insulating substrate is beforehand provided with another under-layer wire the upper-layer wire and a vertical conductive portion which connects the wires to each other, and the under-layer wire is connected to the other under-layer wire under the under-layer insulating film.
7. The manufacturing method of the semiconductor device according to claim 6 , wherein an upper-layer overcoat film having an opening in a portion corresponding to the connection pad portion of the upper-layer wire is beforehand provided on the upper-layer wire and the insulating substrate, a protective film is attached onto the upper-layer overcoat film before removing the base plate, and the protective film is peeled after forming the under-layer wire.
8. The manufacturing method of the semiconductor device according to claim 6 , wherein a protective film is attached onto the upper-layer wire and the insulating substrate before removing the base plate, and the protective film is peeled after forming the under-layer wire.
9. The manufacturing method of the semiconductor device according to claim 1 , wherein after removing the base plate, a through hole is formed through the under-layer insulating film, the insulating layer and the insulating substrate, and the forming the under-layer wire includes forming the upper-layer wire on the insulating substrate, and connecting a vertical conductive portion to the under-layer wire and the upper-layer wire to form the vertical conductive portion in the through hole.
10. The manufacturing method of the semiconductor device according to claim 1 , wherein a protective metal layer and a base metal layer are formed on the base plate made of a metal, the under-layer insulating film is formed on the base metal layer, and the removing the base plate includes the of removing the protective metal layer.
11. The manufacturing method of the semiconductor device according to claim 10 , wherein the upper surface of the base metal layer is beforehand subjected to a coarse surface forming treatment, and the under-layer insulating film is formed of a material including resin.
12. The manufacturing method of the semiconductor device according to claim 11 , wherein the forming the under-layer wire includes forming another base metal layer under the base metal layer, and forming an lower metal layer under the other base metal layer by electrolytic plating,
whereby the under-layer wire has a three-layer structure of the base metal layer, the other base metal layer and the lower metal layer.
13. The manufacturing method of the semiconductor device according to claim 12 , wherein the base plate, the base metal layer, the other base metal layer and the lower metal layer are made of a metal including copper, and the protective metal layer is made of a metal including nickel.