Granted Patent
Utility
US 6,319,851 · App. 09/487,165
Method for packaging semiconductor device having bump electrodes
Inventors:
Ichiro Mihara, Osamu Kuwabara
Patented Case
View Patent ↗
Granted: Nov 20, 2001
Filed: Jan 19, 2000
Inventors
Ichiro Mihara
Osamu Kuwabara
Assignee (at issue)
CASIO COMPUTER CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.