Semiconductor device packaged into chip size and manufacturing method thereof
View Patent ↗A semiconductor device includes a semiconductor substrate having an integrated circuit and at least one connection pad, and at least one external connection electrode electrically connected with the connection pad. A first sealing material is provided on the semiconductor substrate around the external connection electrode, each impurity concentration of an Na ion, a K ion, a Ca ion and Cl ion contained in the first sealing material being not greater than 10 ppm. A second sealing material is provided on at least one of a lower surface and a peripheral side surface of the semiconductor substrate, a total impurity concentration of an Na ion, a K ion, a Ca ion and a Cl ion contained in the second sealing material being not smaller than 100 ppm.
1. A manufacturing method of a semiconductor device comprising:
preparing a semiconductor substrate in a wafer state which has a plurality of connection pads and a plurality of integrated circuits;
forming a plurality of external connection electrodes on the semiconductor substrate in the wafer state;
forming a first sealing film made of a first sealing material on the semiconductor substrate around the external connection electrodes, the first sealing material having each impurity concentration of an Na ion, a K ion, a Ca ion and a Cl ion which is not greater than 10 ppm;
cutting the semiconductor substrate in the wafer state and the first sealing film to form grooves having a predetermined width which divide the semiconductor substrate into each semiconductor substrate;
forming a second sealing film consisting of a second sealing material on a lower surface of the semiconductor substrates including the inside of the grooves, the second sealing material having a total impurity concentration of an Na ion, a K ion, a Ca ion and a Cl ion which is not smaller than 100 ppm; and
cutting the second sealing film formed in the grooves on the inner side of the grooves having the predetermined width in order to divide the semiconductor substrate in the wafer state into the plurality of semiconductor substrates each having the integrated circuit and connection pad.
2. The manufacturing method of a semiconductor device according to claim 1 , wherein forming the second sealing film on the lower surface of the semiconductor substrate in the wafer state including the inside of the grooves is based on one of a screen printing method, a spin coat method and a die coat method.
3. The manufacturing method of a semiconductor device according to claim 1 , further comprising attaching a film on a surface of the first sealing film before forming the grooves having the predetermined width.
4. The manufacturing method of a semiconductor device according to claim 3 , further comprising peeling the film attached on the surface of the first sealing film from the surface of the first sealing film after forming the second sealing film on the lower surface of the semiconductor substrate in the wafer state including the inside of the grooves.
5. The manufacturing method of a semiconductor device according to claim 3 , wherein forming the grooves having the predetermined width has forming to an intermediate point in a thickness direction of the film attached on the surface of the first sealing film, and forming the second sealing film consisting of the second sealing material on the lower surface of the semiconductor substrates including the inside of the groove includes forming a part of the second sealing film formed in the groove to protrude from the surface of the first sealing film.
6. The manufacturing method of a semiconductor device according to claim 4 , comprising removing the part of the second sealing film protruding from the surface of the first sealing film so that the surfaces of the first sealing film and the second sealing film are set on the same level after peeling the film.
7. The manufacturing method of a semiconductor device according to claim 4 , comprising attaching a second film on the second sealing film formed on the lower surface of the semiconductor substrates before cutting the second sealing film formed in the grooves on the inner side of the grooves having the predetermined width.
8. A manufacturing method of a semiconductor device comprising:
preparing a semiconductor substrate in a wafer state which has a plurality of connection pads and a plurality of integrated circuits;
forming a plurality of external connection electrodes on the semiconductor substrate in the wafer state;
forming a first sealing film made of a first sealing material on the semiconductor substrate in the wafer state around the external connection electrodes, the first sealing material having each impurity concentration of an Na ion, a K ion, a Ca ion and a Cl ion which is not greater than 10 ppm;
attaching a lower surface of the semiconductor substrate in the wafer state on a first film;
cutting to an intermediate point of the first film, the semiconductor substrate in the wafer state and the first sealing film in a thickness direction to form grooves;
attaching a second film on an upper surface of the first sealing film and peeling the first film from the lower surface of the semiconductor substrate in the wafer state;
forming a second sealing film consisting of a second sealing material on the lower surface of the semiconductor substrate in the wafer state and the inside of the grooves, the second sealing material having a total impurity concentration of an Na ion, a K ion, a Ca ion and a Cl ion which is not smaller than 100 ppm; and
cutting the second sealing film formed in the grooves on the inner side of the grooves having the predetermined width to divide the semiconductor substrate in the wafer state into the plurality of semiconductor substrates each having the integrated circuit and connection pad.