Semiconductor device
View Patent ↗A semiconductor device includes a semiconductor constructing body formed on a base member, and having a semiconductor substrate and a plurality of external connecting electrodes formed on the semiconductor substrate. A wiring board is formed around the semiconductor constructing body, and has first interconnections on at least a surface thereof. Second interconnections are formed on the semiconductor constructing body and wiring board, and electrically connected to the external connecting electrodes of the semiconductor constructing body.
1. A semiconductor device comprising:
a base member;
a semiconductor constructing body formed on the base member, and having a semiconductor substrate and a plurality of external connecting electrodes formed on the semiconductor substrate;
a wiring board formed around the semiconductor constructing body, and having first interconnections on at least a surface thereof; and
second interconnections formed on the semiconductor constructing body and wiring board, and electrically connected to the external connecting electrodes of the semiconductor constructing body.
2. A device according to claim 1 , wherein the semiconductor constructing body has a sealing film formed between the external connecting electrodes on the semiconductor substrate.
3. A device according to claim 1 , wherein the base member has, on at least a surface thereof, third interconnections electrically connected to the first interconnections of the wiring board.
4. A device according to claim 1 , wherein the base member is made of a material containing a thermosetting resin.
5. A device according to claim 4 , wherein the base member contains a reinforcing material.
6. A device according to claim 4 , further comprising an insulating film corresponding to the base member formed on the semiconductor constructing body and second interconnections.
7. A device according to claim 6 , wherein the insulating film has substantially the same area as the base member.
8. A device according to claim 6 , wherein the insulating film is made of a material containing a thermosetting resin.
9. A device according to claim 6 , wherein the insulating film contains a reinforcing material.
10. A device according to claim 6 , further comprising fourth interconnections formed on the insulating film.
11. A device according to claim 10 , wherein at least one of the fourth interconnections extends over the insulating film, and has a connecting pad portion which is positioned above the wiring board.
12. A device according to claim 11 , further comprising an overcoat film which is formed on the insulating film, and covers a portion except for the connecting pad portion of the fourth interconnections.
13. A device according to claim 12 , wherein a solder ball is formed on the connecting pad portion of the fourth interconnections and a surface of a portion of the overcoat film near the connecting pad portion, and connected to the connecting pad portion.
14. A device according to claim 1 , wherein the wiring board constitutes a multilayered wiring board.
15. A device according to claim 1 , further comprising an insulating layer formed between the semiconductor constructing body and wiring board.
16. A device according to claim 1 , which further comprises an upper insulating film formed on the semiconductor constructing body, and wherein the second interconnections are formed on the upper insulating film.
17. A device according to claim 1 , further comprising a support plate placed between the semiconductor constructing body and base member.
18. A device according to claim 1 , wherein the semiconductor constructing body is carried on the base member by a fixing force of the base member.
19. A device according to claim 1 , wherein the semiconductor constructing body has columnar electrodes as the external connecting electrodes, and the sealing film is formed between the columnar electrodes on the semiconductor substrate.
20. A device according to claim 19 , wherein the semiconductor constructing body has an area larger than the semiconductor substrate, and is integrated with a support plate which supports the semiconductor substrate, and with a peripheral insulating layer which covers side surfaces of the semiconductor substrate and sealing film, thereby forming a semiconductor block together with the semiconductor substrate, columnar electrodes, sealing film, support plate, and peripheral insulating layer.
21. A device according to claim 1 , wherein the base member has third interconnections on a surface opposite to the surface on which the semiconductor constructing body is mounted, and electronic parts are electrically connected to the third interconnections.
22. A semiconductor device comprising:
a semiconductor block including a semiconductor substrate, a plurality of external connecting electrodes formed on the semiconductor substrate, a sealing film formed between the external connecting electrodes on the semiconductor substrate and a support plate carrying the semiconductor substrate;
a wiring board formed around the semiconductor block and including a wiring,
a base member carrying the semiconductor block and the wiring board, and having an area;
an insulating film formed on the semiconductor block and the wiring board, the insulating film opposing to the base member and having substantially the same area as the base member, and
a plurality of interconnections formed on at least one of the base member and the insulating film and electrically connected to the external connecting electrodes.
23. A device according to claim 22 , further comprising a peripheral insulating film which covers side surfaces of the semiconductor substrate and sealing film.