Semiconductor package and method of fabricating the same
View Patent ↗A semiconductor package includes a semiconductor substrate having a device region on one surface thereof, and a connecting pad electrically connected to the device region. A support substrate is formed on a side of one surface of the semiconductor substrate. An external electrode formed on a side of the other surface of the semiconductor substrate. A connecting wire is partially extended outside the semiconductor substrate for electrically connecting the connecting pad and external electrode.
1. A semiconductor package comprising:
a semiconductor substrate including a device region on a first surface thereof, and a connecting pad electrically connected to the device region;
a connecting wire which is formed on a side of the first surface of the semiconductor substrate and which includes a first end electrically connected to the connecting pad and a second end extending outside of the semiconductor substrate;
an insulating film formed on the second surface of the semiconductor substrate and the connecting wire and having a hole at a position corresponding to the second end of the connecting wire;
a support substrate formed on the side of the first surface of the semiconductor substrate so as to support the semiconductor substrate;
an external electrode formed on the insulating film; and
a distribution wire for electrically connecting the connecting wire and external electrode via the hole in the insulating film.
2. The package according to claim 1 , wherein the connecting wire comprises a metal plating layer.
3. The package according to claim 1 , wherein the connecting wire includes a portion in close contact with the first surface of the semiconductor substrate.
4. The package according to claim 1 , wherein the connecting wire is formed in close contact with the support substrate.
5. The package according to claim 1 , further comprising a projecting connecting electrode between the connecting pad and connecting wire.
6. The package according to claim 1 , wherein the external electrode comprises a columnar electrode, and a solder ball is formed on the columnar external electrode.
7. The package according to claim 6 , wherein an encapsulating film is formed around the columnar electrode on the insulating film.
8. The package according to claim 1 , wherein the device region comprises a photoelectric conversion device region.
9. The package according to claim 1 , wherein the support substrate comprises a glass substrate.
10. The package according to claim 9 , wherein one of a transparent adhesive layer and a transparent encapsulating layer is formed between the semiconductor substrate and glass substrate.
11. A semiconductor package comprising:
a semiconductor substrate including a device region on a first surface thereof, and a connecting pad electrically connected to the device region;
a support substrate formed on a side of the first surface of the semiconductor substrate;
an external electrode formed on a side of a second surface of the semiconductor substrate; and
connecting means, partially extended outside the semiconductor substrate, for electrically connecting the connecting pad and external electrode;
wherein the connecting means includes a distribution wire extended to the side of the second surface of the semiconductor substrate, and a connecting wire formed on a surface of the support substrate opposing the semiconductor substrate, wherein the connecting wire comprises a first end portion connected to the connecting pad, and a second end portion extended outside the semiconductor substrate, and
wherein a columnar electrode is formed on the second end portion of the connecting wire, and the distribution wire is connected to the columnar electrode.
12. The package according to claim 11 , wherein an insulating film is formed between the second surface of the semiconductor substrate and the distribution wire.