Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base member
View Patent ↗A semiconductor device includes a base member made of a material containing at least a thermosetting resin, and at least one semiconductor constructing body mounted on the base member, and having a semiconductor substrate and a plurality of external connecting electrodes formed on the semiconductor substrate. An insulating layer is formed on the base member around the semiconductor constructing body. An interconnection of at least one layer is formed on one sides of the semiconductor constructing body and insulating layer, electrically connected to the external connecting electrode of the semiconductor constructing body, and having a connecting pad portion, the semiconductor substrate is fixed to the base member by fixing force of the base member.
1. A semiconductor device comprising:
a base member comprising a thermosetting resin which has a flat upper surface;
at least one semiconductor constructing body which is mounted on the flat upper surface of the base member, and which includes a semiconductor substrate and a plurality of external connecting electrodes formed on the semiconductor substrate;
an insulating layer which is formed around the semiconductor constructing body on the flat upper surface of the base member, and which has a uniform thickness through an entire area thereof that is substantially identical to a thickness of the semiconductor constructing body; and
an interconnection which has at least one layer and includes a connecting pad portion, and which is formed on the semiconductor constructing body and the insulating layer and is electrically connected to one of the external connecting electrodes of the semiconductor constructing body,
wherein the semiconductor substrate is directly fixed to the thermosetting resin of the base member.
2. A device according to claim 1 , wherein the base member contains a reinforcing material.
3. A device according to claim 1 , wherein the external connecting electrodes of the semiconductor constructing body comprise columnar electrodes.
4. A device according to claim 1 , further comprising an upper insulating film formed on the semiconductor constructing body and the insulating layer, wherein the interconnection includes a portion formed on the upper insulating film.
5. A device according to claim 1 , further comprising a hard sheet which supports the base material.
6. A device according to claim 2 , wherein the reinforcing material is made of an inorganic material.
7. A device according to claim 2 , wherein the reinforcing material is impregnated with a portion of the thermosetting resin.
8. A device according to claim 4 , wherein the upper insulating film contains a thermosetting resin and a reinforcing material.
9. A device according to claim 5 , wherein the hard sheet is made of a metal.