IP Library › Assignment 027493/0207
Patent Assignment
Reel/Frame 027493/0207

Change of Name

Recorded: 2012-01-06 Pages: 13
Assignor
OKI SEMICONDUCTOR CO., LTD.
Executed: 2011-10-01
Assignee
LAPIS SEMICONDUCTOR CO., LTD.
550-1 HIGASHIASAKAWA-CHO, HACHIOJI-SHI,, TOKYO,, JAPAN
Covered Properties (2)
Semiconductor Device Having Thin Film Passive Element
Patent: 6,847,066 →
Application: 09/924,293 →
Publication: US 2002/0017730
Semiconductor Device Having a Chip Size Package Including a Passive Element
Patent: 6,639,299 →
Application: 10/118,403 →
Publication: US 2002/0149086
Related Assignments (7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 8, 2001
From: TAHARA, IWAO; MIHARA, ICHIRO; AOKI, YUTAKA
To: INTEGRATED ELECTRONICS & PACKAGING TECHNOLOGIES, INC.; CASIO COMPUTER CO., LTD.
Reel/Frame 012069/0768 →
Change of Name Dec 18, 2008
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022038/0711 →
Change of Ownership by Corporate Separation Jan 3, 2012
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027465/0812 →
Change of Ownership by Corporate Separation-to Correct Assignee's Address on Reel 027465, Frame 0812 Jan 6, 2012
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027492/0449 →
Change of Address Mar 21, 2014
From: LAPIS SEMICONDUCTOR CO., LTD.,
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0049 →
Merger Nov 23, 2016
From: TERA PROBE, INC.
To: OUME ELECTRONICS CO., LTD.
Reel/Frame 040413/0559 →
Merger Dec 20, 2016
From: TERAMIKROS, INC.
To: TERA PROBE, INC.
Reel/Frame 041038/0117 →