IP Library Assignment 015845/0406
Patent Assignment
Reel/Frame 015845/0406

Assignment of Assignor's Interest

Recorded: 2004-10-04 Pages: 4
Assignors
ZHAO, YAN
Executed: 2004-08-27
YEH, CHANG-CHUN
Executed: 2004-09-26
CHEN, ZHONG-WEI
Executed: 2004-09-29
JAU, JACK
Executed: 2004-09-23
Assignee
HERMES-MICROVISION (TAIWAN) INC.
18 CREATIN ROAD 1, SCIENCE BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property (1)
Method for in-Line Monitoring of via/Contact Holes Etch Process Based on Test Structures in Semiconductor Wafer Manufacturing
Patent: 7,105,436 →
Application: 10/865,230 →
Publication: US 2005/0026310
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 29, 2020
From: HERMES MICROVISION, INC.
To: HERMES MICROVISION INCORPORATED B.V.
Reel/Frame 054866/0742 →
Assignment of Assignor's Interest Dec 29, 2020
From: HERMES MICROVISION INCORPORATED B.V.
To: ASML NETHERLANDS B.V.
Reel/Frame 054870/0156 →