Patent Assignment
Reel/Frame 054870/0156
Assignment of Assignor's Interest
Recorded: 2020-12-29
Pages: 19
Assignor
HERMES MICROVISION INCORPORATED B.V.
Executed: 2018-12-19
Assignee
ASML NETHERLANDS B.V.
DE RUN 6501, VELDHOVEN, 5504 DR, NETHERLANDS
Covered Properties
(162)
Method for in-Line Monitoring of via/Contact Holes Etch Process Based on Test Structures in Semiconductor Wafer Manufacturing
Method for in-Line Monitoring of via/Contact Holes Etch Process Based on Test Structures in Semiconductor Wafer Manufacturing
Method for in-Line Monitoring of via/Contact Holes Etch Process Based on Test Structures in Semiconductor Wafer Manufacturing
Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturing
Application:
60/332,016 →
Method and System of Using a Scanning Electron Microscope in Semiconductor Wafer Inspection with Z-Stage Focus
System and Method for Removing Charges with Enhanced Efficiency
System and Method for Sample Charge Control
System and Method for Removing Organic Residue from a Charged Particle Beam System
Patent:
8,092,641 →
Application:
11/199,898 →
Electron Gun with Magnetic Immersion Double Condenser Lenses
Patent:
7,893,406 →
Application:
11/476,411 →
Electron Gun with Magnetic Immersion Double Condenser Lenses
Method and System for Detecting or Reviewing Open Contacts on a Semiconductor Device
Electron Beam Apparatus to Collect Side-View and/or Plane-View Image with in-Lens Sectional Detector
System and Method for a Charged Particle Beam
System and Method for a Charged Particle Beam
In-Line Overlay Measurement Using Charged Particle Beam System
Optical Auto Focusing System and Method for Electron Beam Inspection Tool
System and Method to Determine Focus Parameters During an Electron Beam Inspection
Apparatus for Increasing Electric Conductivity to a Semiconductor Wafer Substrate When Exposure to Electron Beam
Structure and Method for Determining a Defect in Integrated Circuit Manufacturing Process
Structure and Method for Determining a Defect in Integrated Circuit Manufacturing Process
Structure and Method for Determining a Defect in Integrated Circuit Manufacturing Process
Structure and Method for Determining a Defect in Integrated Circuit Manufacturing Process
Thermal Field Emission Cathode
Electron Beam Apparatus
Wafer Grounding Methodology
Method and System for Heating Substrate in Vacuum Environment and Method and System for Identifying Defects on Substrate
Electron Beam Apparatus
Method and System of Classifying Defects on a Wafer
Application:
12/343,201 →
Publication:
US 2010/0158346
Method and System of Classifying Defects on a Wafer
Method and System of Classifying Defects on a Wafer
E-Beam Defect Review System
Operation Stage for Wafer Edge Inspection and Review
Method for Determining Abnormal Characteristics in Integrated Circuit Manufacturing Process
Application:
12/109,243 →
Publication:
US 2008/0267489
Method of Controlling Particle Absorption on a Wafer Sample Being Inspected by a Charged Particle Beam Imaging System
Method of Controlling Particle Absorption on a Wafer Sample Being Inspected by a Charged Particle Beam Imaging System
Method and Handling Apparatus for Placing Patterning Device on Support Member for Charged Particle Beam Imaging
Patterning Device Holding Apparatus and Application Thereof
Method for Regulating Scanning Sample Surface Charge in Continuous and Leap-and-Scan Scanning Mode Imaging Process
Apparatus for Detecting a Sample
Test Structure for Charged Particle Beam Inspection and Method for Fabricating the Same
Method and System for Determining a Defect During Sample Inspection Involving Charged Particle Beam Imaging
Method and Apparatus for Charged Particle Beam Inspection
Method and Apparatus for Charged Particle Beam Inspection
Charged Particle Beam Imaging Assembly and Imaging Method Thereof
Method for Characterizing Identified Defects During Charged Particle Beam Inspection and Application Thereof
Method for Inspecting Overlay Shift Defect During Semiconductor Manufacturing and Apparatus Thereof
Method for Inspecting Overlay Shift Defect During Semiconductor Manufacturing and Apparatus Thereof
Method and Apparatus for Identifying Plug-to-Plug Short from a Charged Particle Microscopic Image
Wafer Grounding and Biasing Method, Apparatus, and Application
Wafer Grounding and Biasing Method, Apparatus, and Application
Discharging Method for Charged Particle Beam Imaging
Method for Forming Memory Cell Transistor
Method for Forming Memory Cell Transistor
Charged Particle Beam Inspection Method
Multi-Axis Magnetic Lens
Substrate and Die Defect Inspection Method
Method and Apparatus for Obtaining Images by Raster Scanning Charged Particle Beam Over Patterned Substrate on a Continuous Mode Stage
Method and Machine for Examining Wafers
Method for Venting Gas into Closed Space and Gas Supply Assembly Thereof
Test Structure for Charged Particle Beam Inspection and Method for Defect Determination Using the Same
Test Structure for Charged Particle Beam Inspection and Method for Defect Determination Using the Same
Charged Particle Detection Devices
Charged Particle System Including Segmented Detection Elements
Method for Examining a Sample by Using a Charged Particle Beam
Method for Examining a Sample by Using a Charged Particle Beam
Z-Stage Configuration and Application Thereof
Method for Characterizing Vibrational Performance of Charged Particle Beam Microscope System and Application Thereof
Method and System for Determining a Defect During Charged Particle Beam Inspection of a Sample
Charged Particle Beam Imaging Method and System Thereof
Dynamic Focus Adjustment with Optical Height Detection Apparatus in Electron Beam System
Dynamic Focus Adjustment with Optical Height Detection Apparatus in Electron Beam System
Movable Detector for Charged Particle Beam Inspection or Review
Filament for Electron Source
Particle Detection System
Particle Detection System
Apparatus of Plural Charged Particle Beams with Multi-Axis Magnetic Lens
Apparatus of Plural Charged Particle Beams with Multi-Axis Magnetic Lens
Charged Particle Apparatus
Particle Detection System
Charged Particle Beam Detection Unit with Multi Type Detection Subunits
Method for Inspecting Euv Reticle and Apparatus Thereof
Method for Inspecting Euv Reticle and Apparatus Thereof
Selectable Coulomb Aperture in E-Beam System
Monochromator for Charged Particle Beam Apparatus
Patent:
8,274,046 →
Application:
13/111,851 →
Monochromator for Charged Particle Beam Apparatus
Structure for Discharging Extreme Ultraviolet Mask
Structure Electron Beam Inspection System for Inspecting Extreme Ultraviolet Mask and Structure for Discharging Extreme Ultraviolet Mask
Method and System for Inspecting an Euv Mask
Structure Electron Beam Inspection System for Inspecting Extreme Ultraviolet Mask and Structure for Discharging Extreme Ultraviolet Mask
Method and System for Inspecting and Grounding an EUV Mask
Method and System for Inspecting an Euv Mask
Structure Electron Beam Inspection System for Inspecting Extreme Ultraviolet Mask and Structure for Discharging Extreme Ultraviolet Mask
Method and System for Fast Inspecting Defects
Patent:
9,494,856 →
Application:
13/154,483 →
Method and System for Fast Inspecting Defects
Patent:
9,541,824 →
Application:
14/268,213 →
Method and System for Fast Inspecting Defects
Patent:
10,380,731 →
Application:
14/697,066 →
Wien Filter with Reduced Field Leakage
Patent:
8,421,029 →
Application:
13/298,651 →
Wien Filter
Methods for Promoting Semiconductor Manufacturing Yield and Classifying Defects During Fabricating a Semiconductor Device, and Computer Readable Mediums Encoded with a Computer Program Implementing the Same
Patent:
9,251,581 →
Application:
13/073,405 →
Method and System for Filtering Noises in an Image Scanned by Charged Particles
Patent:
8,712,184 →
Application:
13/311,043 →
Phase Detector
Method and System for Measuring Critical Dimension and Monitoring Fabrication Uniformity
Method and System for Measuring Critical Dimension and Monitoring Fabrication Uniformity
Method and System for Measuring Critical Dimension and Monitoring Fabrication Uniformity
Method and System for Measuring Critical Dimension and Monitoring Fabrication Uniformity
Method for Inspecting Localized Image and System Thereof
Patent:
8,606,017 →
Application:
13/073,161 →
Method and Apparatus for Reducing Substrate Edge Effect During Inspection
Patent:
8,294,094 →
Application:
13/211,206 →
Charged Particle System for Reticle / Wafer Defects Inspection and Review
Metal Seal for Ultra High Vacuum System
Metal Seal for Ultra High Vacuum System
Multi-axis Magnetic Lens for Focusing a Plurality of Charged Particle Beams
Multi-Axis Magnetic Lens for Focusing a Plurality of Charged Particle Beams
High Efficiency Secondary and Back Scattered Electron Detector
High Efficiency Scintillator Detector for Charged Particle Detection
Structure for Inspecting Defects in Word Line Array Fabricated by SADP Process and Method Thereof
Patent:
8,748,814 →
Application:
13/826,015 →
Method and System for Enhancing Image Quality
Patent:
9,002,097 →
Application:
13/776,939 →
Method and System for Enhancing Image Quality
Patent:
9,436,985 →
Application:
14/595,582 →
Reticle Operation System
Multi-axis Magnetic Lens for Focusing a Plurality of Charged Particle Beams
Charged Particle Beam Apparatus
System and Method for Controlling Charge-up in an Electron Beam Apparatus
System and Method for Controlling Charge-up in an Electron Beam Apparatus
System and Method for Controlling Charge-up in an Electron Beam Apparatus
Charged Particle Beam Apparatus
Charged Particle Beam Apparatus
Charged Particle Beam Apparatus
Charged Particle Beam Apparatus
Energy Filter for Charged Particle Beam Apparatus
Energy-discrimination detection device
Method for Improving Performance of an Energy Filter
Patent:
9,048,062 →
Application:
14/611,741 →
Energy Filter for Charged Particle Beam Apparatus
Electron Beam Apparatus
Patent:
9,048,063 →
Application:
14/611,854 →
Apparatus of Plural Charged Particle Beams with Multi-Axis Magnetic Lens
Hot Spot Identification, Inspection, and Review
Multi-Axis Magnetic Lens for Focusing a Plurality of Charged Particle Beams
Swing Objective Lens
Charged Particle Source
Charged Particle Source
Charged Particle Source
Charged Particle Source
Charged Particle Source
Method and Compound System for Inspecting and Reviewing Defects
System and Method for Calibrating Charge-Regulating Module
Apparatus of Plural Charged Particle Beams with Multi-axis Magnetic Lenses
EBeam Inspection Method
Laser SDE Effect Compensation by Adaptive Tuning
Objective Lens System for Fast Scanning Large FOV
Objective Lens System for Fast Scanning Large Fov
Local Alignment Point Calibration Method in Die Inspection
Apparatus of Plural Charged-Particle Beams
Apparatus of Plural Charged-Particle Beams
Apparatus of Plural Charged-Particle Beams
Apparatus of Plural Charged-Particle Beams
Apparatus of Plural Charged-Particle Beams
Apparatus of Plural Charged-Particle Beams
Apparatus of Plural Charged-Particle Beams
Apparatus of Plural Charged-Particle Beams
Load Lock System for Charged Particle Beam Imaging
Apparatus of Plural Charged-Particle Beams
Test Device for Defect Inspection
Apparatus of Plural Charged-Particle Beams
Inspection Method and System
Patent:
10,102,619 →
Application:
14/738,791 →
Inspection Method and System
Patent:
9,965,844 →
Application:
15/250,184 →
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 21, 2002
From: PAN, CHUNG-SHIH; WANG, YI-XIANG; DESAI, ANIL
To: HERMES-MICORVISION, INC.
Reel/Frame 012725/0183 →
Assignment of Assignor's Interest
Apr 11, 2003
From: ZHAO, YAN; YEH, CHANG-CHUN; CHEN, ZHONGWEI; JAU, JACK
To: HERMES-MICROVISION, INC.
Reel/Frame 013942/0003 →
Assignment of Assignor's Interest
Apr 14, 2004
From: ZHAO, YAN; YEH, CHANG-CHUN; CHEN, ZHONGWEI; JAU, JACK
To: HERMES-MICROVISION, INC.
Reel/Frame 014520/0672 →
Assignment of Assignor's Interest
Apr 19, 2004
From: CHEN, ZHONG WEI
To: HERMES-MICROVISION (TAIWAN) INC.
Reel/Frame 015225/0702 →
Assignment of Assignor's Interest
Oct 4, 2004
From: ZHAO, YAN; YEH, CHANG-CHUN; CHEN, ZHONG-WEI; JAU, JACK
To: HERMES-MICROVISION (TAIWAN) INC.
Reel/Frame 015845/0406 →
Corrective Coversheet to Correct the Assignor Previously Recorded on Reel 015225, Frame 0702.
Nov 10, 2004
From: HERMES-MICROVISION, INC.
To: HERMES-MICROVISION (TAIWAN) INC.
Reel/Frame 015381/0028 →
Assignment of Assignor's Interest
Jun 2, 2005
From: WANG, YI XIANG; YE, GUOFAN
To: HERMES-MICROVISION, INC.
Reel/Frame 016631/0214 →
Assignment of Assignor's Interest
Aug 8, 2005
From: XIAO, HONG
To: HERMES MICROVISION, INC.
Reel/Frame 016878/0238 →
Assignment of Assignor's Interest
Nov 3, 2005
From: CHEN, ZHONG-WEI
To: HERMES-MICROVISION, INC.
Reel/Frame 017156/0895 →
Assignment of Assignor's Interest
Aug 31, 2006
From: ZHAO, FREDERICK Y.; JAU, JACK Y.
To: HERMES MICROVISION, INC.
Reel/Frame 018267/0965 →
Assignment of Assignor's Interest
Sep 28, 2006
From: ZHANG, XU; CHEN, ZHONG-WEI
To: HERMES-MICROVISION, INC.
Reel/Frame 018342/0667 →
Assignment of Assignor's Interest
Apr 26, 2007
From: XIAO, HONG
To: HERMES MICROVISION, INC. (TAIWAN)
Reel/Frame 019218/0706 →
Assignment of Assignor's Interest
May 30, 2007
From: TSENG, CHIA-HUA; CHEN, ZHONG-WEI; LIU, XUEDONG
To: HERMES MICROVISION, INC. (TAIWAN)
Reel/Frame 019358/0141 →
Assignment of Assignor's Interest
May 31, 2007
From: TSENG, CHI-HUA; CHEN, ZHONG-WEI; LIU, XUEDONG
To: HERMES MICROVISION, INC. (TAIWAN)
Reel/Frame 019363/0460 →
Assignment of Assignor's Interest
May 31, 2007
From: TSENG, CHI-HUA; CHEN, ZHONG-WEI; LIU, XUEDONG
To: HERMES MICROVISION, INC. (TAIWAN)
Reel/Frame 019363/0518 →
Assignment of Assignor's Interest
Sep 26, 2007
From: WANG, YI XIANG; NGUYEN, VAN-DUC; ZHANG, JIAN
To: HERMES-MICROVISION, INC.
Reel/Frame 019880/0069 →
Assignment of Assignor's Interest
Nov 14, 2007
From: LIU, XUEDONG; DONG, ZHONGHUA; FANG, WEI; CHEN, ZHONG-WEI
To: HERMES MICROVISION, INC. (TAIWAN)
Reel/Frame 020160/0654 →
Assignment of Assignor's Interest
Jan 22, 2008
From: LIU, XUEDONG; ZHANG, XU; WANG, JOE; TSENG, EDWARD
To: HERMES-MICROVISION, INC.
Reel/Frame 020407/0166 →
Assignment of Assignor's Interest
Apr 15, 2008
From: FANG, WEI; JAU, JACK Y.; XIAO, HONG
To: HERMES MICROVISION, INC.
Reel/Frame 020804/0367 →
Assignment of Assignor's Interest
Jul 24, 2008
From: CHEN, ZHONGWEI; WANG, YI XIANG; DOU, JUYING
To: HERMES-MICROVISION, INC.
Reel/Frame 021289/0071 →
Assignment of Assignor's Interest
Jun 18, 2009
From: HERMES-MICROVISION, INC.
To: HERMES-MICROVISION (TAIWAN) INC.
Reel/Frame 022846/0087 →
Assignment of Assignor's Interest
Jun 18, 2009
From: ZHAO, YAN; YEH, CHANG-CHUN; CHEN, ZHONGWEI; JAU, JACK
To: HERMES-MICROVISION, INC.
Reel/Frame 022846/0068 →
Assignment of Assignor's Interest
Dec 6, 2011
From: LIU, XUEDONG; ZHANG, XU; WANG, JOE; TSENG, EDWARD
To: HERMES-MICROVISION, INC.
Reel/Frame 027328/0565 →
Correct the Receiving Party Data on the Previously Recorded Cover Sheet at Reel/Frame 019358/0141
Nov 20, 2018
From: TSENG, CHIA-HUA; CHEN, ZHONG-WEI; LIU, XUEDONG
To: HERMES MICROVISION, INC.
Reel/Frame 047614/0594 →
Assignment of Assignor's Interest
Dec 14, 2018
From: HERMES MICROVISION, INC. (USA, MILPITAS)
To: HERMES MICROVISION, INC. (TW, HSINCHU CITY)
Reel/Frame 047785/0571 →